DS12CR887-5+【PDF 16/23 页】IC RTC W/RAM 128 BYTE 24-EDIP

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Sheet目录1993

Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent

licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and

max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.

Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 ________________________________ 23

2013 Maxim Integrated Products, Inc.

Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.

DS12R885/DS12CR887/DS12R887

RTCs with Constant-Voltage Trickle Charger

Revision History

REVISION

NUMBER

REVISION

DATE

DESCRIPTION

PAGES

CHANGED

4/04

Initial release of DS12R885

—

4/04

Added DS12R887 and DS12CR887 to data sheet

All

12/04

Initial release of DS12R887

All

4/06

Corrected Intel Bus Write Timing, Intel Bus Read Timing, IRQ Release Delay Timing,

Power-Up/Down Timing, and Functional Diagram diagrams; added the EDIP paragraph

to the Handling, PC Board Layout, and Assembly section.

5, 6, 7, 21

5/06

Changed pin 16 from N.C. to GND for the SO package.

10, 21

2/07

Updated 114 bytes bullet in the Features section; updated the Ordering Information;

corrected the Intel Bus Read Timing diagram; added a note about how the missing

VBACKUP pin on the DS12CR887 and DS12R887 is internally connected to a lithium

cell; added the Package Information table.

1, 6, 11, 22

4/10

Updated the storage temperature ranges, added the lead temperature, and updated the

soldering temperature for all packages in the Absolute Maximum Ratings; removed

the DS12R885 and DS12CR887 leaded parts from the Ordering Information table.

1, 2, 22

9/13

Corrected BGA soldering temperature in the Absolute Maximum Ratings and

Handling, PC Board Layout, and Assembly section.

1, 2, 21

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